US PATENT SUBCLASS 228 / 235.1
.~.~ Mode of applying pressure

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
234.1  DF  .~ Specific mode of heating or applying pressure {3}
235.1.~.~ Mode of applying pressure {1}
235.2  DF  .~.~.~> Roll bonding {1}

DEFINITION

Classification: 228/235.1

Mode of applying pressure:

(under subclass 234.1) Process wherein the procedure of or implement for applying force between the meeting faces to effect bonding is expressed in a claim.

(1) Note. Included herein is applying pressure by vacuum, by magnetic attraction, isostatically, etc.