US PATENT SUBCLASS 228 / 217
.~.~ Using getter

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
214  DF  .~ With protecting of work or filler or applying flux {5}
217.~.~ Using getter

DEFINITION

Classification: 228/217

(under subclass 214) Process wherein for bonding the work is isolated within a chamber within which a solid material having an affinity for undesirable gas(es) is placed to rid the environment of the bond of such gas(es).

(1) Note. The gas most commonly gettered is oxygen.