US PATENT SUBCLASS 228 / 211
.~.~ Chemical

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
203  DF  .~ With pretreating other than heating or cooling of work part of filler prior to bonding and any application of filler {4}
211.~.~ Chemical

DEFINITION

Classification: 228/211

(under subclass 203) Process wherein the change in the work part(s) or the filler includes a molecular change.