US PATENT SUBCLASS 228 / 206
.~.~.~ Chemical

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
203  DF  .~ With pretreating other than heating or cooling of work part of filler prior to bonding and any application of filler {4}
205  DF  .~.~ Cleaning {1}
206.~.~.~ Chemical {1}
207  DF  .~.~.~.~> Applying flux

DEFINITION

Classification: 228/206

(under subclass 205) Process wherein the foreign material is removed at least in part by a molecular change in the parts, filler or foreign material.