US PATENT SUBCLASS 228 / 202
.~.~.~ Chemical

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
199  DF  .~ With subsequent treating other than heating of bonded parts and/or filler material {2}
201  DF  .~.~ Cleaning {1}
202.~.~.~ Chemical

DEFINITION

Classification: 228/202

(under subclass 201) Process wherein the foreign material is removed at least in part by a molecular change in the product or the foreign material.