US PATENT SUBCLASS 228 / 200
.~.~ Cooling under particular conditions

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
199  DF  .~ With subsequent treating other than heating of bonded parts and/or filler material {2}
200.~.~ Cooling under particular conditions

DEFINITION

Classification: 228/200

(under subclass 199) Process wherein the change brought about is a reduction in the thermal level of the product of the bonding operation and wherein the change is brought about in

a prescribed order or rate or manner.