US PATENT SUBCLASS 228 / 193
.~ Diffusion type


Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
193.~ Diffusion type {2}
194  DF  .~.~> Using intermediate diffusion facilitating material
195  DF  .~.~> With incipient melting of bonding surface


DEFINITION

Classification: 228/193

(under subclass 101) Process wherein the meeting faces are heated to a prescribed temperature below the melting point and are subjected to intimate engagement such that the molecules of one face intermix with those of the other face.

(1) Note. A solid filler material may or may not be used in the process of this subclass; however, the filler is heated up to but below its melting point and/or any molten filler produced during the process must be substantially absorbed by the work parts to fall within the scope of this subclass.

(2) Note. Most of the patents including a claim proper for this subclass include specific reference to the time period of exposure of the meeting faces to heat and pressure; e.g., the parts will be subjected to heat and pressure for approximately half hour.