US PATENT SUBCLASS 228 / 111.5
.~.~ Soldering or liquid phase bonding

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
110.1  DF  .~ Using high frequency vibratory energy (e.g., ultrasonic) {2}
111.5.~.~ Soldering or liquid phase bonding

DEFINITION

Classification: 228/111.5

Soldering or liquid phase bonding:

Process under 110.1 comprising fusion bonding by use of filler material that (a) is made liquid by application of heat which is insufficient to make the material being bonded liquid or (b) is liquid before being subjected to vibratory energy.