US PATENT SUBCLASS 205 / 291
.~.~ Copper


Current as of: June, 1999
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205 /   HD   ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN, AND METHODS OF PREPARING THE COMPOSITIONS

80  DF  ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) {42}
261  DF  .~ Depositing predominantly single metal coating {14}
291.~.~ Copper {4}
292  DF  .~.~.~> Utilizing specified anode
293  DF  .~.~.~> Utilizing inorganic cyanide-containing bath {1}
295  DF  .~.~.~> Utilizing alkaline bath
296  DF  .~.~.~> Utilizing organic compound-containing bath {1}


DEFINITION

Classification: 205/291

Copper:

(under subclass 261) Subject matter wherein the single metal consists essentially of copper.