US PATENT SUBCLASS 205 / 239
.~.~ Copper-containing alloy

Current as of: June, 1999
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205 /   HD   ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN, AND METHODS OF PREPARING THE COMPOSITIONS

80  DF  ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) {42}
238  DF  .~ Depositing predominantly alloy coating {6}
239.~.~ Copper-containing alloy {3}
240  DF  .~.~.~> Including zinc (e.g., brass, etc.)
241  DF  .~.~.~> Including tin (e.g., bronze, etc.)
242  DF  .~.~.~> Including noble metal (e.g., gold-copper-cadmium alloy, etc.)

DEFINITION

Classification: 205/239

Copper-containing alloy:

(under subclass 238) Subject matter wherein the alloy contains metallic copper (i.e., copper in the free uncombined state) as one of the essential constituents.

SEE OR SEARCH THIS CLASS, SUBCLASS:

291+, for processes of electrolytically coating with copper.