US PATENT SUBCLASS 205 / 210
.~.~ Treating substrate with liquid other than tap water (e.g., for removing foreign material, etching, activating, etc.)

Current as of: June, 1999
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205 /   HD   ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN, AND METHODS OF PREPARING THE COMPOSITIONS

80  DF  ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) {42}
205  DF  .~ Treating substrate prior to coating {3}
210.~.~ Treating substrate with liquid other than tap water (e.g., for removing foreign material, etching, activating, etc.) {7}
211  DF  .~.~.~> Liquid is nonaqueous (e.g., hydrocarbon solvent, fused bath, etc.)
212  DF  .~.~.~> Predominantly titanium, vanadium, zirconium, niobium, hafnium, tantalum, molybdenum, or tungsten substrate
213  DF  .~.~.~> Predominantly aluminum substrate {1}
215  DF  .~.~.~> Predominantly copper, zinc, or tin substrate
216  DF  .~.~.~> Predominantly cobalt or nickel substrate
217  DF  .~.~.~> Predominantly iron or steel substrate {1}
219  DF  .~.~.~> Electrolytic treatment

DEFINITION

Classification: 205/210

Treating substrate with liquid other than tap water (e.g., for removing foreign material, etching, activating, etc.):

(under subclass 205) Subject matter wherein the substrate is treated with a liquid other than tap water prior to coating.

SEE OR SEARCH CLASS

134, Cleaning and Liquid Contact With Solids, for methods of cleaning in general.

216, Etching a Substrate: Processes, for etching processes.