US PATENT SUBCLASS 205 / 206
.~.~ Contacting substrate with solid member or material (e.g., polishing, rolling, etc.)

Current as of: June, 1999
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205 /   HD   ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN, AND METHODS OF PREPARING THE COMPOSITIONS

80  DF  ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) {42}
205  DF  .~ Treating substrate prior to coating {3}
206.~.~ Contacting substrate with solid member or material (e.g., polishing, rolling, etc.) {2}
207  DF  .~.~.~> Heating substrate
208  DF  .~.~.~> Blasting substrate with particulate material

DEFINITION

Classification: 205/206

Contacting substrate with solid member or material (e.g., polishing, rolling, etc.):

(under subclass 205) Subject matter wherein the substrate is contacted with a solid member or material prior to coating.