US PATENT SUBCLASS 205 / 187-- .~.~.~ Nonelectrolytic coating by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.)

US PATENT SUBCLASS 205 / 187
.~.~.~ Nonelectrolytic coating by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.)

Current as of: June, 1999
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205 /	HD	ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN, AND METHODS OF PREPARING THE COMPOSITIONS

80	DF	ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) {42}
183	DF	.~ Forming nonelectrolytic coating before depositing predominantly single metal or alloy electrolytic coating {1}
184	DF	.~.~ Nonelectrolytic coating or coatings all contain single metal or alloy {3}
187		.~.~.~ Nonelectrolytic coating by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.)

DEFINITION

Classification: 205/187

Nonelectrolytic coating by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.):

(under subclass 184) Subject matter wherein a nonelectrolytic coating is formed by plating from a bath containing metal ions and a reducing agent.

SEE OR SEARCH THIS CLASS, SUBCLASS:

167+, for processes of applying conductive material to a synthetic resin substrate by plating from a bath containing metal ions and reducing agent before depositing electrolytic coating.