US PATENT SUBCLASS 174 / 52.4
.~.~.~ Flat housing for electronic device (e.g., flat pack, dual-in-line package)

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


174 /   HD   ELECTRICITY: CONDUCTORS AND INSULATORS

50  DF  BOXES AND HOUSINGS {4}
52.1  DF  .~ With electric device or mounting means therefor {5}
52.3  DF  .~.~ Sealed {3}
52.4.~.~.~ Flat housing for electronic device (e.g., flat pack, dual-in-line package)

DEFINITION

Classification: 174/52.4

Flat housing for electronic device (e.g., flat pack, dual-in-line package):

(under subclass 52.3) Subject matter wherein the box or housing has a generally flat shape and houses or is particularly adapted to house an electronic device, such as an integrated circuit or a transistor.

(1) Note. Included in this subclass are electronic packages known in the trade as "Flat-Packs" and "Dual-In-Line"

packages.

(2) Note. This subclass provides for electronic packages in combination with lead frames, but does not take lead frames, per se. For the structure of lead frames, per se, see Class 257, subclasses 666 and 677. However, if stock material is claimed either as an individual lead frame without being labeled "lead frame", or if the lead frame structure is a strip of interconnected lead frames prior to separation into individual lead frames, see Class 428, subclasses 571-4.

SEE OR SEARCH CLASS

257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), appropriate subclasses for active solid-state semiconductor devices, per se, especially

678+, for active solid- state device housings, in general.