US PATENT SUBCLASS 174 / 50.61
.~.~ With bonded seal for conductive member (e.g., glass to metal)

Current as of: June, 1999
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174 /   HD   ELECTRICITY: CONDUCTORS AND INSULATORS

50  DF  BOXES AND HOUSINGS {4}
50.5  DF  .~ Hermetic sealed envelope type {9}
50.61.~.~ With bonded seal for conductive member (e.g., glass to metal) {3}
50.62  DF  .~.~.~> With cement or plastic
50.63  DF  .~.~.~> Metal disk or ring-type seal
50.64  DF  .~.~.~> Foil or flat lead-in

DEFINITION

Classification: 174/50.61

(under subclass 50.5) Subjects matter wherein a lead conductor which passes through the wall of the envelope is sealed to the envelope by means of a bonded seal.

(1) Note. A bonded joint is a joint in which the joining is performed by casting, welding, soldering, brazing or other method requiring the use of molten or semi-molten material, cement, or other adhesive, or where at least one of the parts to be joined is made of plastic and the joint is made by pressing the parts together so that they adhere to each other. The usual glass-to-metal seal is an example of a bonded joint.

(2) Note. This and the indented subclasses are residual places for patents for envelopes with bonded lead-ins which involve more than mere joint structure such as would be classified in one of the classes providing for joints and which do not involve sufficient other structure to be classified in the above subclasses of this class or in another class.

SEE OR SEARCH THIS CLASS, SUBCLASS:

151+, for devices (e.g., bushings for insulating a conductor from a wall or plate through which the conductor extends). Some of these bushings include a bonded joint between the lead-in conductor and the insulator or between the insulator and the wall or plate. Where only the structure of the lead-in conductor, the wall of the envelope and the means for insulating it from the wall is claimed, the device is classified in subclasses 151+ as a bushing, even though the envelope is claimed where no characteristics of the envelope are claimed in addition to the bushing structure.

SEE OR SEARCH CLASS 65, Glass Manufacturing,

36+, for a process of fusion bonding glass to a preformed part by a glassworking operation.

313, Electric Lamp and Discharge Devices,

317+, for electric lamps and electric space discharge devices having lead-in wires passing through the envelope walls and sealed to the wall by a bonded seal.

403, Joints and Connections,

265+, for molded joints in general.

428, Stock Material or Miscellaneous Articles,

630, for stock comprising plural adjacent metallic components and an additional silica or other oxide component.