US PATENT SUBCLASS 174 / 50.58
.~.~.~ By fused-type seal

Current as of: June, 1999
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174 /   HD   ELECTRICITY: CONDUCTORS AND INSULATORS

50  DF  BOXES AND HOUSINGS {4}
50.5  DF  .~ Hermetic sealed envelope type {9}
50.57  DF  .~.~ Stem or sealing disk attached to envelope neck {1}
50.58.~.~.~ By fused-type seal

DEFINITION

Classification: 174/50.58

(under subclass 50.57) Subject matter where the disk, stem structure or supporting structure for the lead-in is joined to the envelope by a fused seal.

(1) Note. The seal may be a glass to glass joint, a metal to metal joint or a glass to metal joint. Where cement is

used to join the disk or stem structure to the envelope, see subclass 50.57.

SEE OR SEARCH THIS CLASS, SUBCLASS:

50.61+, for bonded seals between a lead-in conductor and the envelope wall.