US PATENT SUBCLASS 174 / 256
.~.~ With particular material

Current as of: June, 1999
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174 /   HD   ELECTRICITY: CONDUCTORS AND INSULATORS

68.1  DF  CONDUITS, CABLES OR CONDUCTORS {15}
250  DF  .~ Preformed panel circuit arrangement (e.g., printed circuit) {9}
256.~.~ With particular material {3}
257  DF  .~.~.~> Conducting (e.g., ink)
258  DF  .~.~.~> Insulating
259  DF  .~.~.~> Adhesive/bonding

DEFINITION

Classification: 174/256

With particular material:

(under subclass 250) Subject matter wherein at least a part of the circuit board structure is composed of one or more specific substances.