US PATENT SUBCLASS 164 / 525
.~.~.~.~ Particular binder material

Current as of: June, 1999
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164 /   HD   METAL FOUNDING

1  DF  PROCESS {6}
6  DF  .~ Shaping a forming surface (e.g., mold making, etc.) {8}
15  DF  .~.~ Shaping fluent material to form mold {9}
520  DF  .~.~.~ Utilizing particular mold materials {6}
525.~.~.~.~ Particular binder material {2}
526  DF  .~.~.~.~.~> Resin containing {1}
528  DF  .~.~.~.~.~> Inorganic material

DEFINITION

Classification: 164/525

Particular binder material:

(under subclass 520) Process wherein significance is attributed to binding material utilized in shaping a mold structure.