US PATENT SUBCLASS 156 / 526
.~.~.~.~ Cutting after bonding

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

349  DF  SURFACE BONDING MEANS AND/OR ASSEMBLY MEANS THEREFOR {34}
510  DF  .~ With cutting, punching, piercing, severing, or tearing {9}
523  DF  .~.~ Work traversing type {2}
524  DF  .~.~.~ With liquid applying means {2}
526.~.~.~.~ Cutting after bonding

DEFINITION

Classification: 156/526

(under subclass 524) Apparatus in which the material applied by the work traversing device is severed from the source after contact with the work.