US PATENT SUBCLASS 156 / 515
.~.~ Cutting element simultaneously bonds (e.g., cut seaming)

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

349  DF  SURFACE BONDING MEANS AND/OR ASSEMBLY MEANS THEREFOR {34}
510  DF  .~ With cutting, punching, piercing, severing, or tearing {9}
515.~.~ Cutting element simultaneously bonds (e.g., cut seaming)

DEFINITION

Classification: 156/515

(under subclass 510) Apparatus in which the solid severing member causes bonding along the line of severance at the instant of parting of the lamina.

(1) Note. In this subclass may be found, for example, die cutting devices for stamping out patterned pieces from a stacked tacky rubber sheet where the die causes the cut stack edges to adhere.

SEE OR SEARCH THIS CLASS, SUBCLASS:

251, for laminating methods including a step of simultaneously severing and laminating.