US PATENT SUBCLASS 156 / 380.5-- .~.~.~.~.~.~ With means to change the configuration of a lamina, e.g., folding, deforming, etc.

US PATENT SUBCLASS 156 / 380.5
.~.~.~.~.~.~ With means to change the configuration of a lamina, e.g., folding, deforming, etc.

Current as of: June, 1999
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156 /	HD	ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

349	DF	SURFACE BONDING MEANS AND/OR ASSEMBLY MEANS THEREFOR {34}
379.6	DF	.~ With means applying wave energy or electrical energy directly to work {4}
379.8	DF	.~.~ With means to assemble laminae or position them relative to each other {3}
380.2	DF	.~.~.~ With electrode or coil member contacting work {1}
380.3	DF	.~.~.~.~ Electrodes on opposing sides of smallest dimension of work {1}
380.4	DF	.~.~.~.~.~ With means moving one electrode toward the other electrode {1}
380.5		.~.~.~.~.~.~ With means to change the configuration of a lamina, e.g., folding, deforming, etc.

DEFINITION

Classification: 156/380.5

With means to change the configuration of a lamina, e.g., folding, deforming, etc.:

(under subclass 380.4) Subject matter including a mechanism for reshaping a lamina to be bonded.

(1) Note. The shape change must be one affecting the planar characteristics of the lamina or a surface of a lamina; merely compressing the workpiece does not indicate classification in this subclass.

(2) Note. An electrode may comprise the reshaping means, or the means may be another, nonelectrically involved, element.