US PATENT SUBCLASS 156 / 354
.~.~.~ And separate means feeding cut pieces in sequence and applying to serially conveyed articles

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

349  DF  SURFACE BONDING MEANS AND/OR ASSEMBLY MEANS THEREFOR {34}
350  DF  .~ Automatic and/or material-triggered control {9}
353  DF  .~.~ Of cutter {2}
354.~.~.~ And separate means feeding cut pieces in sequence and applying to serially conveyed articles

DEFINITION

Classification: 156/354

(under subclass 353) Apparatus having structure in addition to the cutting means for performing the function of transporting the cut segment to that part of the apparatus where joining occurs, or for performing the function of assembling the cut portion with the workpiece to which it is to be adhesively bonded.