US PATENT SUBCLASS 156 / 331.1
.~.~.~.~.~.~ With polymerization completion, i.e., curing, after assembly

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
325  DF  .~.~ Particular adhesive {1}
326  DF  .~.~.~ Organic containing {4}
327  DF  .~.~.~.~ Synthetic resin containing {8}
330.9  DF  .~.~.~.~.~ Nitrogenous resin {4}
331.1.~.~.~.~.~.~ With polymerization completion, i.e., curing, after assembly {4}
331.2  DF  .~.~.~.~.~.~.~> N only in unlinked side-chain or side-ring
331.3  DF  .~.~.~.~.~.~.~> Derived from aldehyde or ketone
331.4  DF  .~.~.~.~.~.~.~> Iso- or thio-cyanate moiety reacted in curing
331.5  DF  .~.~.~.~.~.~.~> N in a ring

DEFINITION

Classification: 156/331.1

With polymerization completion, i.e., curing, after

assembly:

(under subclass 330.9) Subject matter wherein the adhesive is applied in a nonfully polymerized state and after assembly the sandwich is exposed to a condition, e.g., heat, air, water, etc.., sufficient to increase the molecular weight of at least some resin component by reaction of functional groups contained therein.

SEE OR SEARCH THIS CLASS, SUBCLASS:

307.1+, and 309.6, for processes in which an incompletely polymerized self-sustaining lamina is bonded by curing.