US PATENT SUBCLASS 156 / 330
.~.~.~.~.~ Epoxy resin

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
325  DF  .~.~ Particular adhesive {1}
326  DF  .~.~.~ Organic containing {4}
327  DF  .~.~.~.~ Synthetic resin containing {8}
330.~.~.~.~.~ Epoxy resin

DEFINITION

Classification: 156/330

(under subclass 327) Resins which contain epoxy or oxirane groups or are reaction products of compounds having epoxy or oxirane groups, that is containing the triatomic ring [figure]