US PATENT SUBCLASS 156 / 275.7
.~.~.~ With application of adhesive

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
272.2  DF  .~.~ With direct application of electrical, magnetic, or radiant energy to work {11}
275.7.~.~.~ With application of adhesive

DEFINITION

Classification: 156/275.7

With application of adhesive:

(under subclass 272.2) Process wherein an adhesive is applied to a lamina.