US PATENT SUBCLASS 156 / 274.8
.~.~.~.~ With application of adhesive

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
272.2  DF  .~.~ With direct application of electrical, magnetic, or radiant energy to work {11}
274.4  DF  .~.~.~ Exposure of work to electrode {2}
274.8.~.~.~.~ With application of adhesive

DEFINITION

Classification: 156/274.8

With application of adhesive:

(under subclass 274.4) Subject matter wherein an adhesive is applied to at least one lamina before the work is exposed to the electric field produced by the electrode.