US PATENT SUBCLASS 156 / 258
.~.~.~.~ Cutting to shape joining edge surfaces only

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
250  DF  .~.~ With cutting, punching, tearing or severing {8}
256  DF  .~.~.~ Prior to assembly {6}
258.~.~.~.~ Cutting to shape joining edge surfaces only

DEFINITION

Classification: 156/258

(under subclass 256) Processes in which the cutting occurs only on edge surfaces to be bonded one to the other.

SEE OR SEARCH THIS CLASS, SUBCLASS:

159, for splicing methods in which the joining edges of indefinite length laminae have been cut or beveled.

535, for means for laminating combined with means of shaping, scarifying or cleaning joining surfaces.