US PATENT SUBCLASS 156 / 257-- .~.~.~.~ Partial cutting (e.g., grooving or incising)

US PATENT SUBCLASS 156 / 257
.~.~.~.~ Partial cutting (e.g., grooving or incising)

Current as of: June, 1999
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156 /	HD	ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1	DF	METHODS {7}
60	DF	.~ Surface bonding and/or assembly therefor {93}
250	DF	.~.~ With cutting, punching, tearing or severing {8}
256	DF	.~.~.~ Prior to assembly {6}
257		.~.~.~.~ Partial cutting (e.g., grooving or incising)

DEFINITION

Classification: 156/257

(under subclass 256) Processes in which a lamina is cut (1) only partially through a workpiece thickness or (2) partially along the width whereby the workpiece is not separated into plural discrete workpieces.

(1) Note. Processes directed to scoring of a lamina to be joined with another lamina is within the scope of this subclass.

(2) Note. The partial cutting can be through an edge surface as well as through a facing surface of a sheet-like lamina.

SEE OR SEARCH THIS CLASS, SUBCLASS:

268, for processes where the laminae are associated and then there is a partial cutting.

SEE OR SEARCH CLASS

83, Cutting, 861, for processes and apparatus for cutting other than completely through the work.