US PATENT SUBCLASS 156 / 252
.~.~.~ Perforating lamina

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
250  DF  .~.~ With cutting, punching, tearing or severing {8}
252.~.~.~ Perforating lamina {1}
253  DF  .~.~.~.~> Subsequent to assembly of laminae

DEFINITION

Classification: 156/252

(under subclass 250) Processes in which the cutting operation forms a closed perimeter opening extending completely through a lamina.

SEE OR SEARCH THIS CLASS, SUBCLASS:

513+, for laminating apparatus having means for making a hole or aperture in a lamina.

SEE OR SEARCH CLASS

29, Metal Working,

22, for tire punching. 83, Cutting,

30, for processes of puncturing.

234, Selective Cutting (e.g., Punching), appropriate subclasses for selective cutting or punching, per se.