US PATENT SUBCLASS 156 / 251
.~.~.~ And simultaneously bonding (e.g., cut-seaming)

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
250  DF  .~.~ With cutting, punching, tearing or severing {8}
251.~.~.~ And simultaneously bonding (e.g., cut-seaming)

DEFINITION

Classification: 156/251

(under subclass 250) Processes in which the laminae are bonded to each other during the cutting operation.

(1) Note. Included in this subclass, for example, are processes which involve the utilization of a heated cutting implement which, during the cutting operation, makes thermoplastic laminae tacky, thereby causing the portions of the lamina on each side of the cutting tool to become adhesively united.

SEE OR SEARCH THIS CLASS, SUBCLASS:

88, for fray prevention processes which may involve trimming and/or sealing of laminate edges.

515, for cutting apparatus which simultaneously unites the laminae.