US PATENT SUBCLASS 156 / 248
.~.~.~ With cutting of one lamina only while adhered

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
247  DF  .~.~ With stripping of adhered lamina {2}
248.~.~.~ With cutting of one lamina only while adhered

DEFINITION

Classification: 156/248

(under subclass 247) Processes combined with the step of cutting only one of the laminae while still adhered and prior to stripping thereof.

SEE OR SEARCH THIS CLASS, SUBCLASS:

268, for partial cutting, incising or grooving of a laminated sandwich.