US PATENT SUBCLASS 156 / 244.26
.~.~.~.~ Bonding in specified environment (other than temperature)

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
242  DF  .~.~ With lamina formation by molding or casting {4}
244.11  DF  .~.~.~ By extrusion {12}
244.26.~.~.~.~ Bonding in specified environment (other than temperature)

DEFINITION

Classification: 156/244.26

Bonding in specified environment (other than temperature):

(under subclass 244.11) Processes including employment of conditions other than ambient in the bonding step, e.g., pressure, etc.., use of particular medium, e.g., steam or reactive vapor during the bonding, etc..