US PATENT SUBCLASS 156 / 244.18
.~.~.~.~ With cutting, severing, or perforating

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
242  DF  .~.~ With lamina formation by molding or casting {4}
244.11  DF  .~.~.~ By extrusion {12}
244.18.~.~.~.~ With cutting, severing, or perforating {1}
244.19  DF  .~.~.~.~.~> After bonding; e.g., as finishing step, etc.

DEFINITION

Classification: 156/244.18

With cutting, severing, or perforating:

(under subclass 244.11) Processes combined with a step or (1) penetrating the article or a lamina to achieve at least partial separation of a portion of the material of the workpiece, or (2) moving one part of the article or a lamina relative to the other to cause separation of the parts.

(1) Note. The cutting, severing, or perforating may be

prior to, during, or after the bonding step and of any lamina.