US PATENT SUBCLASS 156 / 236
.~.~.~ Solvent other than water to release lamina

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
230  DF  .~.~ Direct contact transfer of adhered lamina from carrier to base {10}
236.~.~.~ Solvent other than water to release lamina

DEFINITION

Classification: 156/236

(under subclass 230) Processes wherein the transfer is aided by solvent action to facilitate release of the lamina from the carrier, said solvent being a fluid other than water, per se.

(1) Note. An aqueous composition containing a nonwater component is within the scope of this subclass.