US PATENT SUBCLASS 156 / 234
.~.~.~ Of portion only of lamina from carrier

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
230  DF  .~.~ Direct contact transfer of adhered lamina from carrier to base {10}
234.~.~.~ Of portion only of lamina from carrier

DEFINITION

Classification: 156/234

(under subclass 230) Processes wherein only a portion of the lamina on the carrier is transferred to the base, the remainder staying adhered to the carrier.

(1) Note. This subclass includes both the processes wherein the transferred portion is a top section of the lamina with a

continuous thickness remaining on the carrier, or where continuous or discontinuous strips or parts of the lamina through the total thickness thereof are transferred.

SEE OR SEARCH THIS CLASS, SUBCLASS:

254, for splitting of sheet lamina in plane intermediate of its faces.

261, for processes of punching sections through a lamina and simultaneously applying laminating pressure to the cutout sections with the same punching device.