US PATENT SUBCLASS 156 / 232
.~.~.~ Carrier is configured mold

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
230  DF  .~.~ Direct contact transfer of adhered lamina from carrier to base {10}
232.~.~.~ Carrier is configured mold

DEFINITION

Classification: 156/232

(under subclass 230) Processes wherein the carrier, on which the lamina is applied or formed, has a configured surface so that the applied or formed lamina will be shaped or molded into a desired configuration or pattern.

SEE OR SEARCH THIS CLASS, SUBCLASS:

245, for lamina formation by casting or molding in a configured mold.