US PATENT SUBCLASS 156 / 221
.~.~.~ Subsequent to assembly

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
196  DF  .~.~ With permanent bending or reshaping or surface deformation of self sustaining lamina {11}
221.~.~.~ Subsequent to assembly {2}
222  DF  .~.~.~.~> Of parallel stacked sheets only {2}
226  DF  .~.~.~.~> Folding only

DEFINITION

Classification: 156/221

(under subclass 196) Processes in which the bending or reshaping occurs after the parts have been brought into assembled relationship.

(1) Note. The assembled laminae need not be adhesively bonded for the purposes of this and indented subclasses.