US PATENT SUBCLASS 156 / 213
.~.~.~.~ Encasing or enveloping the configured lamina

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
196  DF  .~.~ With permanent bending or reshaping or surface deformation of self sustaining lamina {11}
212  DF  .~.~.~ By bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith {3}
213.~.~.~.~ Encasing or enveloping the configured lamina

DEFINITION

Classification: 156/213

(under subclass 212) Processes involving completely enclosing the configured lamina by the lamina or laminae being reshaped.

(1) Note. This subclass includes enclosing the configured

lamina by utilization of more than one additional lamina, e.g., enclosing a sphere by two semi-spherical laminae formed in situ on the sphere.