US PATENT SUBCLASS 156 / 211
.~.~.~ With slitting or removal of material at reshaping area prior to reshaping

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
196  DF  .~.~ With permanent bending or reshaping or surface deformation of self sustaining lamina {11}
211.~.~.~ With slitting or removal of material at reshaping area prior to reshaping

DEFINITION

Classification: 156/211

(under subclass 196) Processes combined with the step of slitting and/or removal of a portion of the material at the reshaping or bending areas only of a lamina.

(1) Note. The purpose of the slitting and/or removal of material is to prevent formation of undulations, gathers or bulges at the bending or reshaping area.