US PATENT SUBCLASS 156 / 168
.~.~.~ With removal of filamentary material subsequent to lamination thereof

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
166  DF  .~.~ Bonding of flexible filamentary material while in indefinite length or running length {5}
168.~.~.~ With removal of filamentary material subsequent to lamination thereof

DEFINITION

Classification: 156/168

(under subclass 166) Processes combined with the step of removing an adhesively secured filamentary material from another material.

SEE OR SEARCH THIS CLASS, SUBCLASS:

153+, for processes of removing an adhesively secured lamina by the step of abrading or grinding.

155, for processes of removing an adhesively secured lamina from another lamina by destruction thereof.

247+, for processes of stripping nonfilamemtary material previously adhesively adhered to another lamina.

344+, for delaminating processes, per se.

SEE OR SEARCH CLASS 29, Metal Working,

426.1+, for processes of disassembly.