US PATENT SUBCLASS 156 / 161
.~.~.~ Of stressed filaments

Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
160  DF  .~.~ Bonding in stressed condition of at least one prestressed element {4}
161.~.~.~ Of stressed filaments

DEFINITION

Classification: 156/161

(under subclass 160) Processes which are directed to application of the external force to slender thread-like laminae.

SEE OR SEARCH THIS CLASS, SUBCLASS:

166+, for processes of bonding flexible filamentary material while in indefinite length or running length.

296, for processes of bonding definite length elongated filaments.

SEE OR SEARCH CLASS

29, Metal Working, appropriate subclasses for processes involving prestressing of filamentary material.