US PATENT SUBCLASS 156 / 155
.~.~ With destruction of solid transitory material; e.g., dissolving, melting, etc.


Current as of: June, 1999
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156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
155.~.~ With destruction of solid transitory material; e.g., dissolving, melting, etc.


DEFINITION

Classification: 156/155

(under subclass 60) Processes combined with the steps of provisionally associating a part with a 204, Chemistry: Electrical and Wave Energy, subclasses 471+ for electrophoretic or electro-osmotic coating or forming of an object and subclasses 192.12+ for glow discharge sputter deposition (e.g., cathode sputtering, etc.) separate solid part or material, performing a laminating operation, and subsequently destroying the separate solid part or material.

(1) Note. The destruction may be accomplished by dissolving, melting or breaking the part into smaller constituents which can be easily removed, e.g., breaking a core into small grains.

SEE OR SEARCH THIS CLASS, SUBCLASS:

153+, for processes of destroying a transitory material by abrading or grinding.

SEE OR SEARCH CLASS

8, Bleaching and Dyeing; Fluid Treatment and Chemical Modification of Textiles and Fibers, 114.6, for processes of swelling textiles which includes the step of destruction of a portion of the textile.

29, Metal Working,

423+, for processes which include destroying separate material which has been temporarily associated to another part.

65, Glass Manufacturing,

23, for a process of glassworking combined with a step of destroying or delaminating a transitorily attached or associated layer.