US PATENT SUBCLASS 156 / 154
.~.~.~ Subsequent to assembly

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


156 /   HD   ADHESIVE BONDING AND MISCELLANEOUS CHEMICAL MANUFACTURE

1  DF  METHODS {7}
60  DF  .~ Surface bonding and/or assembly therefor {93}
153  DF  .~.~ With abrading or grinding of lamina {1}
154.~.~.~ Subsequent to assembly

DEFINITION

Classification: 156/154

(under subclass 153) Processes in which the abrading or grinding step takes place after combining the laminae.

(1) Note. Abrading or grinding of a lamina while associated but not adhesively bonded thereto is classified herein.