US PATENT SUBCLASS 106 / 1.22
.~.~ Metal-depositing composition contains mixtures of metal compounds other than solely as Group IA metal compounds, e.g., electroless

Current as of: June, 1999
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106 /   HD   COMPOSITIONS: COATING OR PLASTIC

*  DD  COATING OR PLASTIC COMPOSITIONS {40}
1.05  DF  .~ Metal-depositing composition or substrate-sensitizing compositions for metal-depositing compositions {6}
1.22.~.~ Metal-depositing composition contains mixtures of metal compounds other than solely as Group IA metal compounds, e.g., electroless {2}
1.23  DF  .~.~.~> At least one metal is a Group IB (Cu, Ag, Au) metal
1.24  DF  .~.~.~> At least one metal is a noble metal of a Group VIII (Ru, Rh, Pd, Os, Ir, Pt) metal

DEFINITION

Classification: 106/1.22

Metal-depositing composition contains mixtures of metal compounds other than solely as Group IA metal compounds. e.g., electroless:

(under subclass 1.05) Subject matter wherein the metal-depositing composition contains mixtures of metal compounds and wherein at least two metal compounds contain metal atoms other than Group IA metal compounds generally used in the electroless metal deposition process.

SEE OR SEARCH THIS CLASS, SUBCLASS:

1.11, for activating or sensitizing substrates for metalizing said substrates with metal-containing compositions by the electroless metal deposition process.

SEE OR SEARCH CLASS

427, Coating Processes, for a process of coating substrates by an electroless metal-deposition process.